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ShenZhen
Add£º
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Rm
828,West Block,Seg Industrial Building
Futian District Shenzhen. |
| Tel£º86-755-83322546 |
| Fax£º86-755-83252897 |
| HongKong
Add£º |
| Flat/Rm
1, Block A 14/F,Goodview Ind Buildings 11Kin Fat St Tuen Mun. HongKong |
| Tel£º852-24624998 |
| Fax£º852-24533529 |
| Email£ºinfo@jinlanic.com |
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Technical
Reference
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DIP: Dual
Inline Package
SOP: Small-Outline Package
BGA: Ball Grid Array
QFP: Quad Flat Package
SOIC: Small Outline IC;
PLCC: Plastic Leaded Chip Carrier
SIP: Single Inline Package
SOT: Small Outline Transistor
TO: Transistor Outline
TSOP: Thin Small Outline Package
TSSOP or TSOP: Thin Shrink Outline Package
ZIP: Zig-Zag Inline Package
PGA: Pin Grid Array;
SIP: Single In-line Package
PSOP: Plastic Small-Outline Package
SOIC: Small Outline IC;
SSOP: Shrink Small-Outline Package
TSOP: hin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
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BGA
Ball Grid Array |
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PGA
Plastic Pin Grid Array
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TSOP
Thin Small Outline Package |
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TSSOP
or TSOP
Thin Shrink Small-Outline Package |
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QFP
Quad Flat Package |
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SOP
Small Outline Package |
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SSOP
Shrink Small-Outline Package |
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DIP
Dual Inline Package |
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PLCC
Plastic Leaded Chip Carrie |
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SOT23 |
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SOT523 |
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SOT89
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TO252
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TO263/TO268 |
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TO220 |
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FTO220
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TO247
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TO8 |
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TO5 |
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TO3 |
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TO52
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TO71
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TO72 |
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TO78 |
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TO92 |
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TO93 |
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TO99 |
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ZIP
Zig-Zag Inline Package |
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